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E-mail:sales@abp.net.cn
E-mail:info@abp.net.cn
Tel:+86-755-26054178
Tel:+86-755-26406742
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Lead Free:
Where We Are And Where We're Going
 
  • It is important that our circuit boards be not only lead free but also RoHS complaint. This means that the printed circuit boards we produce must also meet the restricted RoHS concentration levels for mercury, cadmium, hexavalent chromium, polybrominated biphenyls and polybromiated diphenyl ethers.

    Advanced Circuits is continuing to gather information and data surrounding the various lead free solder alloys, and we are looking for a final solder finish that will provide an acceptable and workable surface for all concerned. It is not Advanced Circuits' intent to replace the current tin lead solder process at this time, but to run it in tandem with a lead free process until the use of leaded solder becomes untenable.

    RoHS Compliant

    Currently any printed circuit board that we produce does not contain any mercury, cadmium, hexavalent chromium, polybrominated biphenyls or polybrominated diphenyl ethers.

    Products we produce that are not processed through hot air solder level for a final finish will currently meet RoHS' no lead restriction. These products would include those that have electroless nickel immersion gold, electroplated gold, white tin or finishes other than tin-lead solder.

    Laminates

    Although we can supply you with a RoHS compliant board today, there would be laminate-based assembly limitations in exposure to high temperatures. It is important to keep in mind that some no lead assembly processes will require the laminate base material to withstand temperatures in excess of 260 degrees C or 500 degrees F. To resolve this, we are adding new high-temperature laminates to our inventory so that our customers will be able to meet the higher temp cycling requirements for some lead free assembly applications.

    Advanced Circuits has submitted samples of high-temperature Isola, Polyclad and Nelco laminates to Underwritters Laboratory for testing and certification. We are anticipating for this testing to be complete in at least six to eight weeks.

    Lead Free Solder

    Advanced Circuits has purchased a new HASL machine that will be used only in the lead free solder process. Once this new unit is installed in the summer of 2005, we will begin producing printed circuit board runs with a lead free solder plating finish.

    Advanced Circuits has not determined the exact lead free solder that will be used on our RoHS complaint PCBs although the current favorite is an alloy of tin and copper. This lead free alloy will allow processing at approximately the same temperature as the solder we use now. Once the choice of solder alloys is made, we will be running a series of processing tests to assure the best possible coverage and surface characteristics. The length of this testing is entirely dependent upon meeting the required quality levels, although we do not anticipate any major issues in this area.

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