Welcome To Visit ABP Electronics Limited

What is BGA?

From:pcb assembly Read:Time:2017-11-19 21:57
ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The leads are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.

Soldering of BGA devices requires precise control and is usually done by automated processes. BGA devices are not suitable for socket mounting.


The BGA is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern which, in operation, conduct electrical signals between the integrated circuit and the printed circuit board (PCB) on which it is placed. In a BGA the pins are replaced by pads on the bottom of the package, each initially with a tiny solder ball stuck to it. These solder spheres can be placed manually or by automated equipment, and are held in place with a tacky flux. The device is placed on a PCB with copper pads in a pattern that matches the solder balls. The assembly is then heated, either in a reflow oven or by an infrared heater, melting the balls. Surface tension causes the molten solder to hold the package in alignment with the circuit board, at the correct separation distance, while the solder cools and solidifies, forming soldered connections between the device and the PCB.

In more advanced technologies, solder balls may be used on both the PCB and the package. Also, in stackedmulti-chip modules, solder balls are used to connect two packages.

High density

The BGA is a solution to the problem of producing a miniature package for an integrated circuit with many hundreds of pins. Pin grid arrays and dual-in-line surface mount (SOIC) packages were being produced with more and more pins, and with decreasing spacing between the pins, but this was causing difficulties for the soldering process. As package pins got closer together, the danger of accidentally bridging adjacent pins with solder grew. BGAs do not have this problem if the solder is factory-applied to the package.

Heat conduction

A further advantage of BGA packages over packages with discrete leads (i.e. packages with legs) is the lower thermal resistance between the package and the PCB. This allows heat generated by the integrated circuit inside the package to flow more easily to the PCB, preventing the chip from overheating.

Noncompliant connections

A disadvantage of BGAs is that the solder balls cannot flex in the way that longer leads can, so they are not mechanically compliant. As with all surface mount devices, bending due to a difference in coefficient of thermal expansion between PCB substrate and BGA (thermal stress) or flexing and vibration (mechanical stress) can cause the solder joints to fracture.

Thermal expansion issues can be overcome by matching the mechanical and thermal characteristics of the PCB to those of the package. Typically, plastic BGA devices more closely match PCB thermal characteristics than ceramic devices.

The predominant use of RoHS compliant lead-free solder alloy assemblies has presented some further challenges to BGAs including "head in pillow" soldering phenomenon, "pad cratering" problems as well as their decreased reliability versus lead-based solder BGAs in extreme operating conditions such as high temperature, high thermal shock and high gravitational force environments, in part due to lower ductility of RoHS-compliant solders.

Mechanical stress issues can be overcome by bonding the devices to the board through a process called "underfilling", which injects an epoxy mixture under the device after it is soldered to the PCB, effectively gluing the BGA device to the PCB. There are several types of underfill materials in use with differing properties relative to workability and thermal transfer. An additional advantage of underfill is that it limits tin whisker growth.

Another solution to non-compliant connections is to put a "compliant layer" in the package that allows the balls to physically move in relation to the package. This technique has become standard for packaging DRAMs in BGA packages.

Other techniques for increasing the board-level reliability of packages include use of low-expansion PCBs for ceramic BGA (CBGA) packages, interposers between the package and PCB, and re-packaging a device.