Rigid Flex PCB

8L Air Gap Rigiid-flex PCB

Layer:8 layer
Application:Industrial Control
Description
Rigid-flex PCB are printed circuit boards highlighted by both rigid and flexible areas that make them ideally suited for a wide range of applications. The typical rigid-flex PCB circuit includes two or more conductive layers that comprise either flexible or rigid insulation material between each one - the outer layers may have either exposed pads or covers. Conductors are found on the rigid layers, while plated through-holes are found in both the rigid and flexible layers.
The Advantages of Rigid-flex PCB Technology
While this type of flexible circuit may be more expensive to design and produce, it does offer a number of important advantages. For instance, the reduced size makes it easier to fit more components into a smaller space. This can actually help to lower overall system costs. Additionally, because they require the need for fewer interconnects and related parts and components, these flexible circuit board can also prove to be more reliable and require less maintenance in the long run.
As with all types of flexible circuit boards, the Rigid-flex PCB will perform well in even the harshest environments, especially those featuring extreme heat. A rigid flex board is also easy to test, making it well-suited for prototyping.
ABP has served companies in industries such as medical, telecommunications and manufacturing with our superior quality Flex-rigid PCB manufacturing services. Our experience and technical expertise enables us to develop custom flex-rigid PCBs for any specific applications. Here is our full feature flex-rigid PCB manufacturing capabilities:

 
Item  
Max. Layer Count 20L
Max. Finished Thickness 3.2mm
Max. Board Size 500X630mm
Min. Laser Dirlled Hole Size 0.1mm
Min. Mechanical Drilled Hole Size 0.15mm
Min. Mechanical Through Hole Aspect Ratio 13:1
Min. Inner Layer Trace Width/Spacing 0.05mm/0.05mm
Min. Outer Layer Trace Width/Spacing 0.075mm/0.075mm
Soldermask Registraction 0.038mm
Min. Soldermask Bridge 0.08mm
Min. BGA Pitch 0.5mm
Min. Single-ended Impedance Tolerance ±10%
Min. Differential Impedance Tolerance ±10%
Base Material General TG,Middle TG,High TG,Halogen Free,Low Dk,Low loss,High CTI,PTFE
Material Shengyi,ITEQ,Rogers
Surface Finish ENIG,ENEPIG,OSP,Glod Plating,Glod Plating+ENIG,Glod Plating+OSP,Immersion Silver,Immersion Tin,Plating Tin
Advanced Product Rigid-flex+HDI Mass Production
(1+N+1)
Sample Production
(2+N+2)
Mass Production
(2+N+2)