Using vias in a PCB design allows the designer to shorten the distance that a trace must be routed in order to complete its connection. Vias are metallic lined holes connected to the metal circuitry of a PCB that conduct an electrical signal between the different layers of the board. Although vias can vary
Deciding on the best testing method for your printed circuit board can be a daunting task. There are plenty of factors to take into consideration, including costs, coverage, and development lead time. However, there are two popular test strategies you’ll often find yourself choosing between: ICT testing vs flying probe testing.
Key Takeaways A PCB’s response to electrical, thermal, and mechanical stimuli depend primarily on the material of the substrate materials. Today’s designers have a range of options for PCB substrate materials, ranging from typical FR4 substrates to specialized low-loss laminates. Different material properties are more desirable in different applications, and designers should choose specific material
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A printed circuit board (PCB) is a thin board made from fiberglass, composite epoxy, or other laminate materials. PCBs are found in various electrical and electronic components such as beepers, radios, radars, computer systems, etc. Different types of PCBs are used based on the applications. What are the various types of PCBs? What are the
Prototyping is a common procedure for most electronic components including printed circuit boards (PCBs). How businesses design and develop their electronic products has changed over the years. This impact can be felt in PCB design, too. Generally, the PCB design serves as the base for PCB prototyping where engineers create schematic diagrams that are referred
Dear Customer, The 2023 Global Sources Electronics Hong Kong Show is coming! Welcome to visit us at Booth. 11N19,11N19U. Looking forward to seeing you! 2023 Global Sources Electronics Hong Kong Show-Spring Edition Booth: 11N19,11N19U Date: 11-Apr-23 to 14-Apr-23 Venue: Asia-World Expo, Hong Kong SAR
What is a Ball Grid Array (BGA) Packaging Technology? BGA is a surface-mount technology that uses an array of solder balls for electrical interconnection. The interconnection is achieved between the package body and the base. Based on different packaging materials, a number of BGA components has been developed such as Ceramic BGA (CBGA), Plastic
Key Takeaways What is reflow soldering? What types of reflow-induced failure can occur during assembly? How to design your PCBA to prevent failures during reflow. To generate any tangible item of any degree of complexity, there are four essential requirements: First, is a clear plan or strategy. Second, is the
The integrity of Printed Circuit Boards is crucial to ensure the reliability of the electronic product. To this end, process control measurement has to be implemented to optimize the SMT PCB Assembly. This will ensure that costly errors aren’t found at a later date, which could result in a high failure rate of products.
