Project Description

6 Layer Immersion Gold PCB

Layer:6 layer
Material: FR4
Board Thickness: 1.6m
Size : 120mm*50mm
Surface Finish:Immersion Gold

Immersion gold is a process that applies a very thin layer of gold with displacement of the surface atoms. It means the coating of immersion gold PCB is not very thick, and it can be used for extending the shelf life of parts waiting for soldering operations because of corrosion resistance. Immersion gold has been applied in aluminum and gold wire bonding and PCB fabrication. But it can’t be used to take place electrolytic gold plating because its thickness and adhesion are limited compared to a standard electroplated gold.

Inquiry
Item Capability
Layers 1-30
Thicker Copper 1-6OZ
Products Type HF(High-Frequency)&(Radio Frequency) board, Impedance controlled board , HDI board ,

BGA& Fine Pitch board

Solder Mask Nanya&Taiyo ;LPI & Matt Red, green, yellow,white, blue,black.
Base material FR4(Shengyi China、ITEQ, KB A+,HZ), HI-TG, FR06, Rogers,Taconic、Argon and so on
Finished Surface Conventional HASL,Lead-free HASL,Falsh Gold, ENIG (Immersion Gold)OSP(Entek), Immersion Tin,ImmersionSilver,Hard Gold
Selective Surface Treatment ENIG(immersion Gold)+OSP, ENIG(immersion Gold)+Gold Finger,Flash Gold +Gold Finger,

immersion Silver+ Gold Finger, Immersion Tin+Gold Finger

Technical Specification Minimum line width/gap:3.5/4mil(laser drill)
Minimum hole size:0.15mm(mechanical drill)/4mil(laser drill)
Minimum Annular Ring: 4mil
Max Copper thickness: 6OZ
Max Production size:900×1200mm
Board Thickness:D/S: 0.2-7.0mm, Multilayers:0.40-7.0mm,
Min Solder Mask Bridge:0.08mm
Aspect ratio: 15:1
Plugging Visa capability: 0.2-0.8mm
Tolerance Plated holes Tolerance:0.08mm(min±0.05)
Non-plated hole tolerance:0.05min(min+0/-0.05mm or +0.05/-0mm)
Outline Tolerance:0.15min(min±0.10mm)
Functional test :
Insulating resistance : 50 ohms (mormality)
Peel off strength: 1.4N/mm
Thermal Stress test :2650c,20 seconds
Solder mask hardness:6H
E-Test voltage :500V+15/-0V 30S
Warp and Twist: 0.7% (semiconductor test board≤0.3% )

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