Project Description

Aluminum PCB

ABP Electronics manufactures aluminum PCB with a full selection of high performance and low-cost materials from leading suppliers around the world. Aluminum PCB consists of a dielectric metal base with a bonded copper circuit layer to create superior heat transfer to help cool components while eliminating problems associated with managing fragile ceramics.

Aluminum PCBs can consistently increase durability and long-term reliability of a final product through temperature control and associated reductions in failure rates. Aluminum designs also deliver better mechanical stability and lower thermal expansion levels than other available materials.

Inquiry
Item Capability
Layers 1-30
Thicker Copper 1-6OZ
Products Type HF(High-Frequency)&(Radio Frequency) board, Impedance controlled board , HDI board ,

BGA& Fine Pitch board

Solder Mask Nanya&Taiyo ;LPI & Matt Red, green, yellow,white, blue,black.
Base material FR4(Shengyi China、ITEQ, KB A+,HZ), HI-TG, FR06, Rogers,Taconic、Argon and so on
Finished Surface Conventional HASL,Lead-free HASL,Falsh Gold, ENIG (Immersion Gold)OSP(Entek), Immersion Tin,ImmersionSilver,Hard Gold
Selective Surface Treatment ENIG(immersion Gold)+OSP, ENIG(immersion Gold)+Gold Finger,Flash Gold +Gold Finger,

immersion Silver+ Gold Finger, Immersion Tin+Gold Finger

Technical Specification Minimum line width/gap:3.5/4mil(laser drill)
Minimum hole size:0.15mm(mechanical drill)/4mil(laser drill)
Minimum Annular Ring: 4mil
Max Copper thickness: 6OZ
Max Production size:900×1200mm
Board Thickness:D/S: 0.2-7.0mm, Multilayers:0.40-7.0mm,
Min Solder Mask Bridge:0.08mm
Aspect ratio: 15:1
Plugging Visa capability: 0.2-0.8mm
Tolerance Plated holes Tolerance:0.08mm(min±0.05)
Non-plated hole tolerance:0.05min(min+0/-0.05mm or +0.05/-0mm)
Outline Tolerance:0.15min(min±0.10mm)
Functional test :
Insulating resistance : 50 ohms (mormality)
Peel off strength: 1.4N/mm
Thermal Stress test :2650c,20 seconds
Solder mask hardness:6H
E-Test voltage :500V+15/-0V 30S
Warp and Twist: 0.7% (semiconductor test board≤0.3% )

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