With the rapid development of the electronics industry, Surface Mount Technology (SMT) patch processing has become the mainstream technology in the field of PCB assembly. Reflow soldering, as a core component of SMT assembly, plays a decisive role in the quality of solder joints. This article will focus on the “Key Techniques of Reflow Soldering
Surface Mount Technology (SMT) has revolutionized the electronics manufacturing industry with its ability to place and solder components directly onto the surface of PCBs. However, certain applications may require a localized increase in solder paste or solder volume to ensure reliable joints. This article will explore various strategies to achieve this goal, considering the challenges
Surface Mount Technology (SMT) has become an integral part of the electronics manufacturing industry due to its advanced assembly techniques. The selection of package types in SMT processing is crucial as it directly impacts the performance and reliability of electronic products. This article will discuss several common package types and the precautions associated with them.
