What is PCB Manufacturing?

Here at ABP, PCB service refers to full feature printed circuit board manufacturing service. With 17 years’ experience in PCB fabrication, we have handled hundreds of thousands of PCB projects, and covered almost all kinds of substrate materials including FR4, Aluminum, Rogers, etc.

Specialize in PCBprototype over 10 years
Prototype PCB lead time as quick as 24 hours
The most favorable price in whole industry
Quick turn PCB assembly turnkey services
Start your PCBA order from 1pcs
On-time delivery by DHL & FedEx
Professional technical team provide one-to-one service
Professional QC team, 100% Guaranteed quality

Prototype Printed Circuit Boards Meet High-Quality Standards
ABP offers rapid PCB prototyping services for quick-turn PCB at high quality and low cost. We’re fully compliant with ISO9001:2008 quality management systems, and we have an in-house quality control department to verify that all work meets each regulation depicted by the high standards.
Depending on your custom requirements, we can prototype your PCB within 3-7 days, compared to 6-18 days of Standard PCB service.

Check out our circuit board prototype capabilities in the following table:

Item Capability
Layers 1-30
Thicker Copper 1-6OZ
Products Type HF(High-Frequency)&(Radio Frequency) board, Impedance controlled board , HDI board ,

BGA& Fine Pitch board

Solder Mask Nanya&Taiyo ;LPI & Matt Red, green, yellow,white, blue,black.
Base material FR4(Shengyi China、ITEQ, KB A+,HZ), HI-TG, FR06, Rogers,Taconic、Argon and so on
Finished Surface Conventional HASL,Lead-free HASL,Falsh Gold, ENIG (Immersion Gold)OSP(Entek), Immersion Tin,ImmersionSilver,Hard Gold
Selective Surface Treatment ENIG(immersion Gold)+OSP, ENIG(immersion Gold)+Gold Finger,Flash Gold +Gold Finger,

immersion Silver+ Gold Finger, Immersion Tin+Gold Finger

Technical Specification Minimum line width/gap:3.5/4mil(laser drill)
Minimum hole size:0.15mm(mechanical drill)/4mil(laser drill)
Minimum Annular Ring: 4mil
Max Copper thickness: 6OZ
Max Production size:900×1200mm
Board Thickness:D/S: 0.2-7.0mm, Multilayers:0.40-7.0mm,
Min Solder Mask Bridge:0.08mm
Aspect ratio: 15:1
Plugging Visa capability: 0.2-0.8mm
Tolerance Plated holes Tolerance:0.08mm(min±0.05)
Non-plated hole tolerance:0.05min(min+0/-0.05mm or +0.05/-0mm)
Outline Tolerance:0.15min(min±0.10mm)
Functional test :
Insulating resistance : 50 ohms (mormality)
Peel off strength: 1.4N/mm
Thermal Stress test :2650c,20 seconds
Solder mask hardness:6H
E-Test voltage :500V+15/-0V 30S
Warp and Twist: 0.7% (semiconductor test board≤0.3% )

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