The latest electronica will be held at the Trade Fair Center Messe München from November 12 to 15, 2024! After 6 years, we are cheerful to meet long-term partners and new friends in Munich. Welcome to visit us at booth B1.178 to learn about our latest situation and discuss future industry trends and business needs.
Dear Customer, Due to the National Day Holiday Arrangement, our office and factory will be temporarily out of duty from October 1 to October 6, 2024. We are return on October 7, so you will be able to communicate with us by then or any urgent things you may contact our sales manager directly. In
With the rapid development of the electronics industry, Surface Mount Technology (SMT) patch processing has become the mainstream technology in the field of PCB assembly. Reflow soldering, as a core component of SMT assembly, plays a decisive role in the quality of solder joints. This article will focus on the “Key Techniques of Reflow Soldering
With the rapid advancement of electronic technology, high-frequency and high-frequency and high-speed signal transmission has become a key technology in the electronics industry. High-frequency and high-speed materials, as a core component of electronic printed circuit boards (PCBs), directly impact the quality and reliability of electronic products. This a article will discuss the development of high-frequency
Surface Mount Technology (SMT) has revolutionized the electronics manufacturing industry with its ability to place and solder components directly onto the surface of PCBs. However, certain applications may require a localized increase in solder paste or solder volume to ensure reliable joints. This article will explore various strategies to achieve this goal, considering the challenges
As electronic products become increasingly slim and multifunctional, the use of multilayer printed circuit boards (PCBs) has become widespread in the electronics industry. The interlayer connection technology in multilayer PCBs is a key determinant of their performance. This article will focus on the application of microvias, blind vias, and buried vias in the layer stacking
With the rapid advancement of the electronics industry, PCB assembly technology is continuously evolving. Among these advancements, lead-free soldering technology stands out as an eco-friendly and efficient method that is increasingly becoming the standard in the industry. This article will focus on the application and benefits of lead-free soldering technology in PCB assembly. Traditional soldering
Surface Mount Technology (SMT) has become an integral part of the electronics manufacturing industry due to its advanced assembly techniques. The selection of package types in SMT processing is crucial as it directly impacts the performance and reliability of electronic products. This article will discuss several common package types and the precautions associated with them.
The Internet of Things (IoT) has become an integral part of our daily lives, with a wide range of devices connecting to the internet and sharing data. One of the most crucial components of an IoT device is the Printed Circuit Board (PCB), which provides the electrical connections that allow the device to function. With
Energy storage systems are becoming increasingly important in various applications such as renewable energy, electric vehicles, and grid storage. The printed circuit board (PCB) layout plays a crucial role in the performance and reliability of energy storage systems. In this article, we will discuss the key considerations for PCB layout in energy storage systems and
